What is Green Silicon Carbide?
Green silicon carbide takes petroleum coke and high-quality silica as the main raw materials, adding salt as an additive, and is smelted through a resistant furnace at high temperature.
Its hardness is between corundum and diamond, the mechanical strength is higher than corundum, brittle and sharp.
Main Colors
- Green
Price
USD $2.69-4.66 / kg EXW
Packaging
25 kg bags or customized packaging on request
Physical Properties
| Item | Value |
|---|---|
| Appearance | Green powder |
| Mohs Hardness | 9.2 |
| Basic Mineral | α-SiC |
| True density | ≥3.90g/cm3 |
| Bulk density | 1.2-1.6g/cm3 |
| Crystal | Hexagonal |
| SIC CAS No. | 409-21-2 |
| HS Code | 2849200000 |
Chemical Composition(%)
| Model | Particle Size | SiC | F.C. | Fe₂O₃ |
|---|---|---|---|---|
| GC | F230–F280 (#240–#360) | ≥98.40 | ≤0.20 | ≤0.25 |
| F320–F500 (#400–#800) | ≥98.20 | ≤0.20 | ≤0.30 | |
| F600–F800 (#1000–#1500) | ≥98.00 | ≤0.20 | ≤0.30 | |
| F1000–F1200 (#2000–#2500) | ≥97.60 | ≤0.20 | ≤0.30 | |
| #3000–#8000 | ≥96.50 | ≤0.20 | ≤0.30 | |
| #10000–#20000 | ≥96.00 | ≤0.20 | ≤0.30 |
Particle Distribution(μm)
| Particle Size | D0 | D3 | D50 | D94 |
|---|---|---|---|---|
| #240 | ≤127 | ≤103 | 58.6±3.0 | ≥40.0 |
| #280 | ≤112 | ≤87.0 | 49.4±3.0 | ≥33.0 |
| #320 | ≤98.0 | ≤74.0 | 41.1±2.5 | ≥27.0 |
| #360 | ≤86.0 | ≤66.0 | 36.1±2.0 | ≥23.0 |
| #400 | ≤75.0 | ≤58.0 | 30.9±2.0 | ≥20.0 |
| #500 | ≤63.0 | ≤50.0 | 26.4±2.0 | ≥16.0 |
| #600 | ≤53.0 | ≤43.0 | 21.1±1.5 | ≥13.0 |
| #700 | ≤45.0 | ≤37.0 | 17.9±1.3 | ≥11.0 |
| #800 | ≤38.0 | ≤31.0 | 14.7±1.0 | ≥9.00 |
| #1000 | ≤32.0 | ≤27.0 | 11.9±1.0 | ≥7.00 |
| #1200 | ≤27.0 | ≤23.0 | 9.90±0.80 | ≥5.50 |
| #1500 | ≤23.0 | ≤20.0 | 8.40±0.60 | ≥4.50 |
| #2000 | ≤19.0 | ≤17.0 | 6.90±0.60 | ≥4.00 |
| #2500 | ≤16.0 | ≤14.0 | 5.60±0.50 | ≥3.00 |
| #3000 | ≤13.0 | ≤11.0 | 4.00±0.50 | ≥2.00 |
| #4000 | ≤11.0 | ≤8.00 | 3.00±0.40 | ≥1.30 |
| #6000 | ≤8.00 | ≤5.00 | 2.00±0.40 | ≥0.80 |
| #8000 | ≤6.00 | ≤3.50 | 1.20±0.30 | ≥0.60 |
| #10000 | — | — | 0.51–0.70 | — |
| #20000 | — | — | 0.50 | — |
Applications
- Cutting and grinding of solar silicon wafers, semiconductor silicon wafers, and quartz chips.
- Polishing crystal, solid grain iron.
- Precision polishing and sandblasting of ceramics and special steel.
- Consolidated and coated abrasives.
- Grinding non-metallic materials such as glass, stone, agate and high-end jewelry and jade.
- Manufacture advanced refractory materials, engineering ceramics, heating elements and thermal energy elements, etc.
